Editorial Board

Editor-in-Chief
Jerry Chun-Wei Lin Harbin Institute of Technology – Shenzhen, China
Philippe Fournier-Viger Harbin Institute of Technology – Shenzhen, China

Advisory Board Member
Ajith Abraham Machine Intelligence Research Labs, USA
Longbing Cao University of Technology Sydney, Australia
Han-Chieh Chao National Dong Hwa University (President), Taiwan
Hamido Fujita Iwate Prefectural University, Japan
Tzung-Pei Hong National University of Kaohsiung, Taiwan
Engelbert Mephu Nguifo Université Blaise Pascal – Clermont Ferrand, France
Ponnuthurai Nagaratnam Suganthan Nanyang Technical University, Singapore
Roger Nkambou Université du Québec à Montréal, Canada
Jeng-Shyang Pan Fujian University of Technology, China
Harbin Institute of Technology – Shenzhen, China
Vaclav Snasel VŠB-Technical University of Ostrava, Czech Republic
Ljiljana Trajkovic (FIEEE) Simon Fraser University, Canada
Vincent S. Tseng National Chiao-Tung University, Taiwan
Leon Shyue-Liang Wang National University of Kaohsiung (President), Taiwan
Philip S. Yu (FIEEE) University of Illinois at Chicago, USA
Osmar Zaïane University of Alberta, Canada

Associate Editor
Chien-Ming Chen Harbin Institute of Technology – Shenzhen, China
Chun-Hao Chen Tamkang University, Taiwan
Vicente Garcia Diaz University of Oviedo, Spain
Pinar Karagoz Middle East Technical University, Turkey
Yun Sing Koh University of Auckland, New Zealand
Ivan Lee University of South Australia, Australia
João Mendes Moreira University of Porto, Portugal
I-Hsien Ting National University of Kaohsiung, Taiwan
Chun-Wei Tsai National Chung-Hsing University, Taiwan
Bay Vo Ho Chi Minh City University of Technology, Vietnam
Miroslav Voznak VŠB-Technical University of Ostrava, Czech Republic
Tsu-Yang Wu Harbin Institute of Technology – Shenzhen, China
Mu-En Wu Soochow University, Taiwan
Unil Yun Sejong University, Korea
Ji Zhang University Southern Queensland, Australia

Publicity Editor
Jimmy Ming-Tai Wu Harbin Institute of Technology – Shenzhen, China
 Wensheng Gan  Harbin Institute of Technology – Shenzhen, China

For information about the journal, please contact the following e-mail address: dspr.submit@gmail.com or the editors-in-chief.